Non destructive testing (NDT) of bonded assemblies

Topic description

Specific Challenge:

The aim of the topic is to study non destructive testing technologies and models able to inform on the quality of a bonding, with a focus on kiss bonding. Models will be correlated with mechanical testings of coupons realized with state of the art and innovative bonding technologies. A demonstrator will be developed and applied to coupons and representative use cases of structures. Please refer to the full topic descriptions document published in this call.