Robust package for harsh environment and optimization of electrical characteristic of rectifier bridge using high current diode

Topic description

Scope:

Electrical components need to meet harsher aircraft requirements; mechanical constraints combined with high temperature conditions weaken the die and the packaging of the component. The target is to develop a robust diode package (high reliability) based on an optimized die. The diode component performances shall meet electrical and environmental constraints for a harsh environment. The foreseen application is a high current rectifier leg and/or full bridge operating in harsh mechanical, thermal and fluid constraints.  Please refer for the full and formal topic description to Annex III of the Clean Sky 2 Work Plan 2014-2015 Amendment nr. 1  Version 3 (see under the tab "Topic Conditions and Documents")